CVE-2024-43047: Use After Free in DSP Service
In CISA’s Known Exploited Vulnerabilities catalog: Qualcomm Multiple Chipsets Use-After-Free Vulnerability.
Added , federal remediation due . Known ransomware use: Unknown.
Required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Description
Memory corruption while maintaining memory maps of HLOS memory.
Vector CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H · CWE-416
Status incidents that name it
No tracked status incident names this CVE.
Affected vendors and products
qualcomm: fastconnect_6700_firmwarequalcomm: fastconnect_6800_firmwarequalcomm: fastconnect_6900_firmwarequalcomm: fastconnect_7800_firmwarequalcomm: qam8295p_firmwarequalcomm: qca6174a_firmwarequalcomm: qca6391_firmwarequalcomm: qca6426_firmwarequalcomm: qca6436_firmwarequalcomm: qca6574au_firmwarequalcomm: qca6584au_firmwarequalcomm: qca6595au_firmwarequalcomm: qca6595_firmwarequalcomm: qca6688aq_firmwarequalcomm: qca6696_firmwarequalcomm: qca6698aq_firmwarequalcomm: qcs410_firmwarequalcomm: qcs610_firmwarequalcomm: qcs6490_firmwarequalcomm: qualcomm_video_collaboration_vc1_platform_firmwarequalcomm: qualcomm_video_collaboration_vc3_platform_firmwarequalcomm: sa4150p_firmwarequalcomm: sa4155p_firmwarequalcomm: sa6145p_firmwarequalcomm: sa6150p_firmwarequalcomm: sa6155p_firmwarequalcomm: sa8145p_firmwarequalcomm: sa8150p_firmwarequalcomm: sa8155p_firmwarequalcomm: sa8195p_firmwarequalcomm: sa8295p_firmwarequalcomm: sd660_firmwarequalcomm: sd865_5g_firmwarequalcomm: sg4150p_firmwarequalcomm: sm6225-ad_firmwarequalcomm: snapdragon_660_mobile_platform_firmwarequalcomm: snapdragon_680_4g_mobile_platform_firmwarequalcomm: snapdragon_865\+_5g_firmwarequalcomm: snapdragon_865_5g_mobile_platform_firmwarequalcomm: snapdragon_870_5g_mobile_platform_firmwarequalcomm: snapdragon_888\+_5g_mobile_platform_firmwarequalcomm: snapdragon_888_5g_mobile_platform_firmwarequalcomm: snapdragon_8_gen_1_mobile_platform_firmwarequalcomm: snapdragon_auto_5g_modem-rf_firmwarequalcomm: snapdragon_auto_5g_modem-rf_gen_2_firmwarequalcomm: snapdragon_x55_5g_modem-rf_system_firmwarequalcomm: snapdragon_xr2_5g_platform_firmwarequalcomm: sw5100_firmwarequalcomm: sw5100p_firmwarequalcomm: sxr2130_firmwarequalcomm: wcd9335_firmwarequalcomm: wcd9341_firmwarequalcomm: wcd9370_firmwarequalcomm: wcd9375_firmwarequalcomm: wcd9380_firmwarequalcomm: wcd9385_firmwarequalcomm: wcn3950_firmwarequalcomm: wcn3980_firmwarequalcomm: wcn3988_firmwareQualcomm, Inc.: Snapdragon
References
- CVE record on cve.org (opens in new tab)
- NVD entry (opens in new tab)
- docs.qualcomm.com/product/publicresources/securitybulletin/october-2024-bulletin.html (opens in new tab)
- CVE records from the CVE Program (cve.org). CVE® is a registered trademark of The MITRE Corporation. (opens in new tab)
- This product uses data from the NVD API but is not endorsed or certified by the NVD. (opens in new tab)
- Known Exploited Vulnerabilities catalog from CISA. (opens in new tab)
- EPSS scores from FIRST (Exploit Prediction Scoring System). (opens in new tab)