CVE-2022-22071: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
In CISA’s Known Exploited Vulnerabilities catalog: Qualcomm Multiple Chipsets Use-After-Free Vulnerability.
Added , federal remediation due . Known ransomware use: Unknown.
Required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Description
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Vector CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Status incidents that name it
No tracked status incident names this CVE.
Affected vendors and products
Qualcomm, Inc.: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
References
- CVE record on cve.org (opens in new tab)
- NVD entry (opens in new tab)
- www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin (opens in new tab)
- CVE records from the CVE Program (cve.org). CVE® is a registered trademark of The MITRE Corporation. (opens in new tab)
- This product uses data from the NVD API but is not endorsed or certified by the NVD. (opens in new tab)
- Known Exploited Vulnerabilities catalog from CISA. (opens in new tab)
- EPSS scores from FIRST (Exploit Prediction Scoring System). (opens in new tab)